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NCV7351FD13R2G - onsemi

Description: High Speed (up to 1 Mbps); Compatible with the ISO 11898−2 Standard; VIO Pin on NCV7351D13 Version Allowing Direct Interfacing with 3V to 5V Microcontrollers; EN Pin on NCV7351D1E Version Allowing Switching the transceiver to a Very Low Current OFF Mode; Excellent Electromagnetic Susceptibility (EMS) Level Over Full Frequency Range. Very Low Electromagnetic Emissions (EME) Low EME also Without Common Mode (CM) Choke; Bus Pins Protected Against >15 kV System ESD Pulses; Transmit Data (TxD) Dominant Time−out

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NCV7351FD13R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 CASE 751AZ ISSUE B
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NCV7351FD13R2G Details

  • Manufacturer Part Number:

    NCV7351FD13R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    7.17

  • Data Rate:

    5000 Mbps

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.927 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.727 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN FD TRANSCEIVER

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.937 mm

NCV7351FD13R2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider derating the device's power handling capabilities. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The NCV7351FD13R2G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Ensure that the device is handled in an ESD-controlled environment, and consider adding external ESD protection devices if necessary.
  • To troubleshoot issues with the overcurrent protection feature, check the device's datasheet for the specific overcurrent protection threshold and response time. Verify that the device is properly configured and that the current sense resistor is correctly sized. Use an oscilloscope to monitor the device's behavior and identify any anomalies.
  • When paralleling multiple devices, ensure that each device has its own current sense resistor and that the devices are properly synchronized. Consider using a master-slave configuration to ensure that the devices share the current equally. Additionally, ensure that the PCB layout is designed to minimize current imbalance and thermal mismatch between devices.

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NCV7351FD13R2G Overview

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