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NCV7390DB0R2G - onsemi

Description: Error Detection Circuit and Capability of Single Wire Operation; Sleep Mode with Low Current Consumption and Bus wake−up Function; VCC Pin Allowing Interfacing with 3 V to 5 V Microcontrollers; Low Electromagnetic Emission (EME) and High Electromagnetic Susceptibility; Ground Shift Robustness; Under all Supply Conditions the Chip Behaves Predictably; Thermal Protection; Designed for Systems According to the International Standard ISO 11992−1; Suited Both for 12 V and 24 V Battery Systems Applications; AEC−Q

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NCV7390DB0R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - soic16_10x6p2
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NCV7390DB0R2G Details

  • Manufacturer Part Number:

    NCV7390DB0R2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-16

  • Package Description:

    SOIC-16

  • Manufacturer Package Code:

    751B-05

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Data Rate:

    250 Mbps

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    9.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    CAN TRANSCEIVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4.9 mm

NCV7390DB0R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power dissipation according to the ambient temperature.
  • The NCV7390DB0R2G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of 2 kV human body model (HBM) and 200 V machine model (MM) ESD protection is recommended.
  • Yes, the NCV7390DB0R2G is suitable for high-reliability and automotive applications. It's AEC-Q100 qualified and meets the requirements for automotive-grade reliability. However, it's essential to follow the recommended design guidelines and testing procedures to ensure compliance with the specific application requirements.
  • To troubleshoot issues with the NCV7390DB0R2G, start by reviewing the device's operating conditions, such as voltage, current, and temperature. Check for any signs of physical damage, electrical overstress, or thermal issues. Use oscilloscopes and thermal imaging tools to help identify the root cause of the problem. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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NCV7390DB0R2G Overview

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