Description:Compatible with the ISO 11898−2:2016; CAN FD timing specified up to 5 Mbps; Very low current standby mode with wake−up via the bus; Low Electromagnetic Emission (EME) and high Electromagnetic Immunity; No disturbance of the bus lines with an un−powered node; Transmit data (TxD) dominant timeout function; Under all supply conditions the chip behaves predictably; Very high ESD robustness of bus pins; Thermal protection; Bus pins short circuit proof to supply voltage and ground; Bus pins protected against tran
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
0.9 mm
Supply Current-Max:
105 mA
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Technology:
CMOS
Telecom IC Type:
CAN FD TRANSCEIVER
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3 mm
NCV7446MW0R2G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Also, ensure good thermal design, and consider using a heat sink if necessary.
The NCV7446MW0R2G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
Yes, the NCV7446MW0R2G is AEC-Q100 qualified, making it suitable for automotive applications. However, ensure that you follow the recommended operating conditions and design guidelines to ensure reliable operation in the automotive environment.
Follow the recommended soldering profile, and ensure that the PCB is designed with a solder mask to prevent solder bridging. Use a reflow oven with a controlled temperature profile to prevent overheating or thermal shock.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
NCV7446MW0R2G Overview
Use the download button to access the NCV7446MW0R2G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NCV74,
or try a keyword search, such as Network Interfaces
