Description:Industry-Standard Pinouts; 4.5V to 20V Operating Range; 5-A Peak Sink/Source capability; TTL/CMOS Compatible Input; Three Versions of Dual Independent Drivers: ; 8ns/8ns Typical Rise/Fall Times (1.8-nF Load); 20ns typical propagation delay; Double Current Capability by Paralleling Channels; Rated from –40°C to +140°C; 8-Lead MSOP with exposed pad; Automotive Qualified to AEC-Q100 and PPAP Capable
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Screening Level:
AEC-Q100
Seated Height-Max:
1.1 mm
Supply Current-Max:
3 mA
Supply Voltage-Max:
20 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
12 V
Supply Voltage1-Max:
20 V
Supply Voltage1-Min:
4.5 V
Supply Voltage1-Nom:
12 V
Surface Mount:
YES
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Turn-off Time:
0.029 µs
Turn-on Time:
0.029 µs
Width:
3 mm
NCV81071AZR2G Frequently Asked Questions (FAQs)
The recommended PCB layout for optimal thermal performance involves placing the device on a 2-layer or 4-layer board with a solid ground plane, using thermal vias to connect the exposed pad to the ground plane, and keeping the copper traces as short and wide as possible to minimize thermal resistance.
To ensure reliable startup and shutdown, it is recommended to follow the startup and shutdown sequencing guidelines provided in the datasheet, and to use a soft-start circuit to limit the inrush current during startup. Additionally, a bypass capacitor should be placed close to the device to filter out noise and ensure stable operation.
To ensure EMI and EMC compliance, it is recommended to follow good PCB layout practices, such as keeping the switching node (SW) as short as possible, using a common-mode choke, and placing a shield around the device. Additionally, the device should be placed in a metal enclosure and the PCB should be designed to minimize radiation.
The selection of input and output capacitors depends on the specific application requirements, such as the input voltage, output voltage, and output current. In general, it is recommended to use low-ESR capacitors with a high ripple current rating, and to follow the capacitor selection guidelines provided in the datasheet.
The device has a thermal derating curve that specifies the maximum allowed junction temperature (TJ) at different ambient temperatures. To ensure reliable operation, the device should be operated within the specified thermal derating curve, and the PCB should be designed to provide good thermal conduction and convection.
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Manufacturer Collaborated
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System Verified
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Community Approved
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NCV81071AZR2G Overview
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