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NCV8187AMLE330TCG - onsemi

Description: Low Vin 1.5 V; Ultra Low Noise 15 µVrms; High PSRR 75 dB at 1 kHz; Low Vout from 0.8 V; Power Good Signal; Available in DFN6 2x2 mm and DFN8 3x3mm packages; 150C operating Junction temperature

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NCV8187AMLE330TCG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - DFNW8 3x3, 0.65P_1
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NCV8187AMLE330TCG - onsemi  - 3D model - Small Outline No-lead - DFNW8 3x3, 0.65P_1
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NCV8187AMLE330TCG Details

  • Manufacturer Part Number:

    NCV8187AMLE330TCG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFNW-8

  • Package Description:

    DFNW8, 8-PIN

  • Manufacturer Package Code:

    507AD

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.2 V

  • Dropout Voltage1-Nom:

    0.135 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    S-PDSO-N8

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1.2 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11,26

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    3 mm

NCV8187AMLE330TCG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure the stability of the output voltage, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, make sure to decouple the input and output with suitable capacitors, and use a low-ESR output capacitor to minimize voltage ripple.
  • The maximum ambient temperature for reliable operation is 85°C, as specified in the datasheet. However, it's recommended to derate the device's power dissipation accordingly to ensure reliable operation over the desired temperature range.
  • While it's possible to use a different inductor value or type, it's crucial to ensure that the inductor meets the recommended specifications and is compatible with the device's operating frequency. Consult the datasheet and application notes for guidance on inductor selection.
  • To troubleshoot issues with the device, start by verifying the PCB layout and component values against the recommended design. Check for any signs of overheating, and ensure that the input and output capacitors are suitable for the application. Consult the datasheet and application notes for troubleshooting guidelines.

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