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NCV8518CPDR2G - onsemi

Description: Output Voltage Option: 5.0 V; Output Voltage accuracy: ±2%; Protection Features: - Thermal Shutdown - Current Limitation; AEC-Q100 Grade 1 Qualified and PPAP Capable; Output current up to 250 mA; Low Dropout Voltage; Low Quiescent Current of 70 µA; Low Sleep Mode Current less than 1.0 µA; Micropower Compatible Control Function: - ENABLE - Watchdog - RESET - Wake Up

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PCB Footprints
NCV8518CPDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−8 EP CASE 751AC ISSUE D_2020
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NCV8518CPDR2G - onsemi  - 3D model - Small Outline Packages - SOIC−8 EP CASE 751AC ISSUE D_2020
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NCV8518CPDR2G Details

  • Manufacturer Part Number:

    NCV8518CPDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 EP

  • Manufacturer Package Code:

    751AC

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.75 V

  • Dropout Voltage1-Nom:

    0.356 V

  • Input Voltage Absolute-Max:

    40 V

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    6 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.02%

  • Load Regulation-Max:

    0.03%

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.9 mm

NCV8518CPDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, ensure good thermal design, and consider using a heat sink if necessary. Additionally, consider using a thermistor or thermocouple to monitor the temperature and take corrective action if it exceeds the recommended limit.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and consider adding external ESD protection devices such as TVS diodes or ESD arrays. Additionally, ensure that the PCB design includes ESD protection features such as guard rings and ESD-protected I/Os.
  • Not using the exposed pad can lead to reduced thermal performance, increased thermal resistance, and potentially even device failure. It's recommended to connect the exposed pad to a solid ground plane or a heat sink to ensure optimal thermal performance.

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