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NCV86603BD50R2G - onsemi

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NCV86603BD50R2G - onsemi - PCB symbol
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NCV86603BD50R2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CAST 751-07
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NCV86603BD50R2G - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CAST 751-07
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NCV86603BD50R2G Details

  • Manufacturer Part Number:

    NCV86603BD50R2G

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.6 V

  • Dropout Voltage1-Nom:

    1.2 V

  • Input Voltage Absolute-Max:

    40 V

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    4.5 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Line Regulation-Max:

    0.04%

  • Load Regulation-Max:

    0.02%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.9 mm

NCV86603BD50R2G Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider derating the device's power dissipation according to the ambient temperature.
  • The recommended soldering conditions for NCV86603BD50R2G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350°C. It's also essential to follow the JEDEC J-STD-020 standard for reflow soldering.
  • To troubleshoot OVP and UVP issues, check the input voltage levels, ensure that the device is properly configured, and verify that the protection thresholds are set correctly. Also, check for any noise or ringing on the input lines that could be triggering the protection mechanisms.
  • Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the specified voltage, current, and temperature ranges to guarantee reliable operation.

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NCV86603BD50R2G Overview

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