- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for NCV86604BD33R2G
- Part Number NCV86604BD33R2G
- Manufacturer onsemi
- Pin Count 8
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - SOIC-8 NB CAST 751-07
- Released Date Aug 24, 2015
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
NCV86604BD33R2G Details
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Manufacturer Part Number:
NCV86604BD33R2G
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Brand Name:
ON Semiconductor
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Part Package Code:
SOIC
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Pin Count:
8
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Manufacturer Package Code:
751-07
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.60
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Factory Lead Time:
4 Weeks
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Manufacturer:
onsemi
NCV86604BD33R2G Frequently Asked Questions (FAQs)
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The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal shield to reduce the junction temperature.
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Operating the device beyond the recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to ensure that the device operates within the specified voltage, current, and temperature ranges to guarantee reliable operation.
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To troubleshoot issues related to the device's overcurrent protection feature, check the input voltage, output current, and sense resistor values. Ensure that the sense resistor is correctly connected and that the output current is within the specified limits. Also, verify that the device is not overheating, which can trigger the overcurrent protection feature.
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To minimize EMI and EMC issues, ensure that the device is placed away from sensitive circuits, use a suitable layout and grounding scheme, and add EMI filters or shielding as necessary. Follow the recommended PCB layout guidelines and use a common-mode choke to reduce EMI emissions.
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NCV86604BD33R2G Overview
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