The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
To ensure reliable startup and shutdown, it is recommended to follow the startup and shutdown sequencing guidelines provided in the datasheet. Additionally, a soft-start circuit can be implemented to reduce inrush current and prevent voltage drops during startup.
To reduce EMI and noise, it is recommended to use a pi-filter or a common-mode choke at the input, and to add decoupling capacitors at the output. Additionally, the device should be placed away from noise-sensitive components and the PCB should be designed with EMI shielding in mind.
The selection of input and output capacitors depends on the specific application requirements. In general, low-ESR capacitors with a high ripple current rating are recommended. The capacitor values should be chosen based on the output voltage, output current, and switching frequency.
The device has a maximum junction temperature rating of 150°C. For high-temperature applications, thermal derating is necessary to ensure reliable operation. The datasheet provides thermal derating curves to help determine the maximum power dissipation at a given temperature.
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NCV8668ABD133R2G Overview
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