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NCV8718BMT330TBG - onsemi

Description: Ultra−Low Quiescent Current typ. 4 ??µA over Temperature; Operating Input Voltage Range 2.5 V to 24 V; Adjustable and Fixed Version Available; High PSRR 60dB at 1kHz; Noise typ. 36 ?µVRMS from 100 Hz to 100 kHz; Stable with 1 ?µF output capacitor; Soft−start to Reduce Inrush Current and Overshoots; SOA Limiting for High Vin / High Iout – Static and Dynamic

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PCB Footprints
NCV8718BMT330TBG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFNW6 2x2, 0.65P CASE 511DW ISSUE B-1
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NCV8718BMT330TBG - onsemi  - 3D model - Small Outline No-lead - WDFNW6 2x2, 0.65P CASE 511DW ISSUE B-1
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NCV8718BMT330TBG Details

  • Manufacturer Part Number:

    NCV8718BMT330TBG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Manufacturer Package Code:

    511BR

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-10-25

  • Manufacturer:

    onsemi

  • YTEOL:

    7.3

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.45 V

  • Dropout Voltage1-Nom:

    0.285 V

  • Input Voltage Absolute-Max:

    24 V

  • Input Voltage-Max:

    24 V

  • Input Voltage-Min:

    4.3 V

  • JESD-30 Code:

    S-PDSO-N6

  • Length:

    2 mm

  • Line Regulation-Max:

    0.01%

  • Load Regulation-Max(%):

    0.01%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC6,.08,25

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    2 mm

NCV8718BMT330TBG Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the exposed pad to the ground plane. This helps to dissipate heat efficiently.
  • To ensure proper biasing, make sure to follow the recommended voltage and current ratings specified in the datasheet. Also, ensure that the input and output capacitors are properly selected and placed close to the device to minimize noise and oscillations.
  • The critical components that affect the device's reliability and lifespan are the input and output capacitors, the inductor, and the PCB layout. Poor selection or placement of these components can lead to reduced lifespan or even device failure.
  • To troubleshoot issues, start by checking the PCB layout and component selection. Ensure that the input and output capacitors are properly selected and placed, and that the inductor is of sufficient quality. Also, check the voltage and current ratings to ensure they are within the recommended specifications.
  • To ensure EMI and EMC compliance, follow proper PCB layout guidelines, use shielding and filtering components as necessary, and ensure that the device is properly decoupled from the power supply. Also, consider using a common-mode choke to reduce EMI emissions.

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