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NDC7001C - onsemi

Description: Proprietary SuperSOT™-6 package design using copper lead frame for superior thermal and electrical capabilities; Q2: -0.34 A, 60 V RDS(ON) = 5 Ω @ VGS = -10 V RDS(ON) = 7.5 Ω @ VGS = -4.5 V; High saturation current ; Q1: 0.51 A, 60 V RDS(ON) = 2 Ω @ VGS = 10 V RDS(ON) = 4 Ω @ VGS = 4.5 V; High density cell design for low RDS(ON).

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PCB Footprints
NDC7001C - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SSOT 6L
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NDC7001C - onsemi  - 3D model - SOT23 (6-Pin) - SSOT 6L
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NDC7001C Details

  • Manufacturer Part Number:

    NDC7001C

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.51 A

  • Drain-source On Resistance-Max:

    2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.96 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NDC7001C Frequently Asked Questions (FAQs)

  • A good PCB layout for the NDC7001C involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the power source. Additionally, using a shielded inductor and placing it away from the device can help reduce EMI.
  • To ensure the NDC7001C operates within the recommended junction temperature range, use a heat sink with a thermal resistance of less than 10°C/W, and ensure good airflow around the device. You can also use thermal interface materials to improve heat transfer.
  • The recommended input capacitor type for the NDC7001C is a low-ESR ceramic capacitor with a value of 10uF to 22uF. This helps to filter out high-frequency noise and ensure stable operation.
  • Yes, the NDC7001C is suitable for high-reliability applications. It is built with a robust design and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and manufacturing guidelines to ensure the device operates within its specified parameters.
  • To troubleshoot issues with the NDC7001C, start by checking the input voltage, output voltage, and current. Verify that the device is properly soldered and that the PCB layout is correct. Check for signs of overheating, such as excessive temperature or burning smells. If the issue persists, consult the datasheet and application notes for guidance.

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NDC7001C Overview

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Part Image NDC7001C Fairchild Semiconductor Corporation

Small Signal Field-Effect Transistor, 0.51A I(D), 60V, 2-Element, N-Channel and P-Channel, Silicon, Metal-oxide Semiconductor FET