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NDC7003P - onsemi

Description: Fast switching speed; High performance trench technology for low RDS(ON); SuperSOT™ -6 package: small footprint (72%smaller than standard SO-8); low profile (1mm thick); RDS(ON) = 7 Ω @ VGS = -4.7 V; Low gate charge; -0.34 A, -50 V.   ; RDS(ON) = 5 Ω @ VGS = -10 V

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Symbol
NDC7003P - onsemi - PCB symbol
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PCB Footprints
NDC7003P - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SuperSOT-6
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3D Models
NDC7003P - onsemi - 3D model - SOT23 (6-Pin) - SuperSOT-6
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NDC7003P Details

  • Manufacturer Part Number:

    NDC7003P

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.34 A

  • Drain-source On Resistance-Max:

    5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.96 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NDC7003P Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the inner layers.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum TJ. Monitor the device's thermal performance and adjust the system design as needed.
  • The NDC7003P has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. Use an ESD wrist strap or mat, and ensure that the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.
  • Yes, the NDC7003P is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is used within its specified ratings. Additionally, onsemi provides a dedicated automotive-grade version of the device, which meets the stringent requirements of the automotive industry.
  • Start by reviewing the datasheet and application notes to ensure that the device is used within its specified ratings. Check the PCB layout and assembly for any errors or defects. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue. If the problem persists, contact onsemi's technical support team for further assistance.

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NDC7003P Overview

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