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NDD03N80Z-1G - onsemi

Description: Obsolete - Power MOSFET 800V 2.9A 4.5 Ohm Single N-Channel DPAK

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PCB Footprints
NDD03N80Z-1G - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IPAK CASE 369D−01 ISSUE C
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3D Models
NDD03N80Z-1G - onsemi  - 3D model - Transistor Outline, Vertical - IPAK CASE 369D−01 ISSUE C
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NDD03N80Z-1G Details

  • Manufacturer Part Number:

    NDD03N80Z-1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DPAK INSERTION MOUNT

  • Package Description:

    IPAK-3

  • Pin Count:

    4

  • Manufacturer Package Code:

    369

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    100 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    800 V

  • Drain Current-Max (ID):

    1.9 A

  • Drain-source On Resistance-Max:

    4.5 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    96 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NDD03N80Z-1G Frequently Asked Questions (FAQs)

  • The maximum SOA for the NDD03N80Z-1G is typically defined by the voltage and current ratings, but it's recommended to consult the application note or contact onsemi support for specific guidance on SOA limitations.
  • Proper thermal management involves ensuring good heat sinking, using thermal interface materials, and keeping the device within the recommended operating temperature range. Consult the datasheet and application notes for specific thermal design guidelines.
  • Follow the recommended PCB layout guidelines in the datasheet and application notes, including minimizing trace inductance, using wide traces for power and ground, and keeping sensitive nodes away from noise sources.
  • Follow proper ESD handling procedures, use ESD-protective packaging and storage, and consider adding external ESD protection devices if necessary. Consult the datasheet and application notes for specific ESD protection guidelines.
  • The NDD03N80Z-1G is designed to meet industry-standard reliability and lifespan expectations. Consult the datasheet and application notes for specific information on MTBF, FIT rates, and recommended operating conditions to ensure optimal reliability.

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NDD03N80Z-1G Overview

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