A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor junction temperature and adjust the system design accordingly.
Focus on minimizing parasitic inductance, using a common-mode choke, and adding EMI filters. Ensure proper PCB layout, decoupling, and shielding to reduce radiated emissions.
Use a dedicated gate driver IC, ensure a low-impedance gate drive circuit, and optimize the gate resistance and capacitance for minimal power loss and EMI.
Ensure identical devices, matching thermal performance, and synchronized gate drive signals. Implement a master-slave configuration, and consider using a current-sharing bus to balance current distribution.
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