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NDS9945 - onsemi

Description: Dual MOSFET in surface mount package; High power and current handling capability in a widely used surface mount package; 3.5 A, 60 V RDS(ON) = 0.100 Ω @ VGS = 10 V RDS(ON) = 0.200 Ω @ VGS = 4.5 V; High density cell design for extremely low RDS(ON)

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NDS9945 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751EB ISSUE A
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NDS9945 - onsemi  - 3D model - Small Outline Packages - SOIC8 CASE 751EB ISSUE A
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NDS9945 Details

  • Manufacturer Part Number:

    NDS9945

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    3.5 A

  • Drain-source On Resistance-Max:

    0.1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NDS9945 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Ensure that the input voltage (VIN) is within the recommended range (4.5V to 18V) and that the output voltage (VOUT) is set to the desired value using the feedback resistors (RFBT and RFBG).
  • The maximum output current capability of the NDS9945 is 4A, but it can be limited by the thermal performance of the PCB and the input voltage.
  • Use an overvoltage protection (OVP) circuit and an undervoltage lockout (UVLO) circuit to prevent damage from voltage transients and ensure the device operates within the recommended voltage range.
  • A 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) is recommended for input decoupling, placed as close to the VIN pin as possible.

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