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NDT3055 - onsemi

Description: High density cell design for extremely low RDS(ON); High power and current handling capability in a widely used surface mount package; 4 A, 60 V. RDS(ON) = 0.100 Ω @ VGS = 10 V

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PCB Footprints
NDT3055 - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223 CASE 318H
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3D Models
NDT3055 - onsemi  - 3D model - SOT223 (3-Pin) - SOT-223 CASE 318H
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NDT3055 Details

  • Manufacturer Part Number:

    NDT3055

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223-4 / TO-261-4

  • Manufacturer Package Code:

    318H-01

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.4

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3 W

  • Pulsed Drain Current-Max (IDM):

    25 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

NDT3055 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal path short and use a thermal pad on the bottom of the package.
  • Use a heat sink, ensure good airflow, and follow the recommended thermal design guidelines. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation.
  • Yes, but be aware of the device's switching characteristics and ensure that the switching frequency is within the recommended range (typically up to 100 kHz).
  • Use ESD protection devices, such as TVS diodes or ESD arrays, and follow proper handling and storage procedures to prevent ESD damage.

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NDT3055 Overview

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