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NE5090N - NXP

Description: Addressable relay drive

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PCB Footprints
NE5090N - NXP PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - SOT38-4-ren1
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3D Models
NE5090N - NXP  - 3D model - Dual-In-Line Packages - SOT38-4-ren1
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NE5090N Details

  • Manufacturer Part Number:

    NE5090N

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    PLASTIC, DIP-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    ADDRESSABLE LATCH BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDIP-T16

  • Length:

    19.025 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output Characteristics:

    OPEN-COLLECTOR

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    0.15 A

  • Output Peak Current Limit-Nom:

    0.15 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.2 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.26 µs

  • Turn-on Time:

    1.85 µs

  • Width:

    7.62 mm

NE5090N Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and radiation.
  • Implement a robust thermal design, including a heat sink and thermal vias, to keep the junction temperature below 150°C. Also, ensure proper airflow and avoid thermal hotspots.
  • Use a shielded enclosure, keep the device away from antennas and other RF sources, and implement proper filtering and shielding on the PCB. Also, ensure that the device is properly grounded and decoupled.
  • Use the lowest possible supply voltage, enable power-saving modes, and optimize the clock frequency. Also, consider using a low-dropout regulator (LDO) to reduce power consumption.
  • Use a high-speed oscilloscope and a signal generator to test the device's performance. Measure the output power, frequency, and modulation accuracy. Also, perform temperature and vibration testing to ensure reliability.

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NE5090N Overview

Use the download button to access the NE5090N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NE509, or try a keyword search, such as Peripheral Drivers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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