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NFA50460R4B - onsemi

Description: Optimized for over (10) kHz Switching Frequency; 600 V FS4 RC−IGBT 3−Phase Inverter with Gate Drivers and Protection; Built−In Bootstrap Diodes Simplify PCB Layout; Separate Open−Source Pins from Low−Side IGBTs for Three−Phase Current−Sensing; Optimized for Low Electromagnetic Interference; HVIC Temperature−Sensing Built−In for Temperature Monitoring; Active−HIGH Interface, Works with 3.3 / 5 V Logic, Schmitt−trigger Input; HVIC for Gate Driving and Under−Voltage Protection; Isolation Rating: 1500 Vrms / Mi

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NFA50460R4B - onsemi PCB footprint - Other - Other - NFA50460R4B-1
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NFA50460R4B - onsemi  - 3D model - Other - NFA50460R4B-1
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NFA50460R4B Details

  • Manufacturer Part Number:

    NFA50460R4B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP-023

  • Manufacturer Package Code:

    MODEJ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

  • JESD-609 Code:

    e3

  • Terminal Finish:

    Matte Tin (Sn) - annealed

NFA50460R4B Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components to allow for airflow.
  • To ensure reliable operation at high temperatures, follow the recommended operating conditions, use a suitable heat sink, and consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection for the NFA50460R4B, follow proper handling and storage procedures, use ESD-protective packaging and materials, and consider implementing ESD protection circuits or devices in the system design.
  • The recommended soldering conditions for the NFA50460R4B involve using a soldering iron with a temperature range of 250°C to 260°C, a soldering time of 3-5 seconds, and a peak temperature of 260°C for a maximum of 10 seconds.

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NFA50460R4B Overview

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