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NFAM5065L4BL - onsemi

Description: 650 V - 50 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection; Low-Loss, Short-Circuit Rated IGBTs (FS4); Very Low Thermal Resistance Using; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Single-Grounded Power Supply; Isolation Rating: 2500 Vrms / 1 min.

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PCB Footprints
NFAM5065L4BL - onsemi PCB footprint - Other - Other - DIP39, 54.5x31.0 EP−2 CASE MODGX ISSUE O
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3D Models
NFAM5065L4BL - onsemi  - 3D model - Other - DIP39, 54.5x31.0 EP−2 CASE MODGX ISSUE O
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NFAM5065L4BL Details

  • Manufacturer Part Number:

    NFAM5065L4BL

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP39, 54.50x31.00x5.60, 1.78P EP−2

  • Manufacturer Package Code:

    MODGX

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

NFAM5065L4BL Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat effectively. Additionally, keeping the thermal path short and using a thermal pad on the device can help to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device. It's also crucial to monitor the device's temperature and adjust the operating conditions accordingly.
  • Critical parameters to monitor during operation include the input voltage, output voltage, output current, and temperature. Monitoring these parameters can help prevent damage to the device and ensure reliable operation. It's also recommended to implement overvoltage, undervoltage, and overcurrent protection to prevent damage from abnormal operating conditions.
  • To optimize the output filter design for minimal ripple and noise, consider using a combination of capacitors and inductors with low equivalent series resistance (ESR) and high quality factor (Q). Additionally, use a filter topology that suits the specific application, such as an LC filter or a pi-filter. It's also essential to consider the output voltage ripple and noise requirements of the downstream components.
  • The recommended soldering and assembly techniques for the NFAM5065L4BL include using a reflow soldering process with a peak temperature of 260°C, and ensuring that the device is handled and stored in a static-safe environment. It's also crucial to follow the recommended land pattern and soldering guidelines to prevent damage to the device during assembly.

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NFAM5065L4BL Overview

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