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NFAM5065L4BT - onsemi

Description: 650 V - 50 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection; Low-Loss, Short-Circuit Rated IGBTs (FS4); Very Low Thermal Resistance Using; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Single-Grounded Power Supply; Thermister Built-In; Isolation Rating: 2500 Vrms / 1 min.

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NFAM5065L4BT - onsemi PCB footprint - Other - Other - NFAM5065L4BT-4
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NFAM5065L4BT - onsemi  - 3D model - Other - NFAM5065L4BT-4
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NFAM5065L4BT Details

  • Manufacturer Part Number:

    NFAM5065L4BT

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP39, 54.50x31.00x5.60, 1.78P

  • Package Description:

    DIP-39/30

  • Manufacturer Package Code:

    MODGC

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    INTELLIGENT POWER MODULE(IPM)

  • JESD-30 Code:

    R-XDMA-T30

  • JESD-609 Code:

    e3

  • Length:

    54.5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    30

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    50 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,30LEAD,1.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    13.2 mm

  • Supply Current-Max (Isup):

    6 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    31 mm

NFAM5065L4BT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a heat sink or a thermal plane.
  • To ensure proper biasing, follow the recommended operating conditions in the datasheet, including the input voltage range, output voltage range, and current limits. Additionally, ensure that the input and output capacitors are properly selected and placed close to the device.
  • To minimize EMI and EMC issues, use a shielded layout, keep the switching frequency below 100 MHz, and use a common-mode choke or ferrite bead on the output. Additionally, ensure that the device is properly decoupled and that the PCB layout is optimized for minimal radiation.
  • To troubleshoot issues, start by verifying the PCB layout and component selection. Check for proper decoupling, correct input and output voltage levels, and ensure that the device is operating within its recommended specifications. Use an oscilloscope to measure the output voltage and current, and check for any signs of oscillation or instability.
  • The NFAM5065L4BT is a high-reliability device with a typical lifespan of 10-15 years or more, depending on the operating conditions and environment. However, it's essential to follow proper design and manufacturing guidelines, including temperature derating, to ensure optimal reliability and lifespan.

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NFAM5065L4BT Overview

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