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NFVA23512NP2T - onsemi

Description: Automotive IPM in 34 pin DIP package; WW 1st Automotive qualified grade HV module (AEC−Q100, 101 & AQG(LV)324); 1200 V , 35 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection; Low-Loss, Short-Circuit Rated IGBTs; Very Low Thermal Resistance using Al2O3 DBC Substrate; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing; Built-In NTC Thermistor for Temperature Monitoring and Management; Adjustable Ov

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NFVA23512NP2T - onsemi PCB footprint - Other - Other - NFVA23512NP2T-5
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NFVA23512NP2T - onsemi  - 3D model - Other - NFVA23512NP2T-5
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NFVA23512NP2T Details

  • Manufacturer Part Number:

    NFVA23512NP2T

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP34 80x33, AUTOMOTIVE MODULE

  • Manufacturer Package Code:

    MODGL

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    2019-01-25

  • Manufacturer:

    onsemi

  • YTEOL:

    9.6

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-T34

  • JESD-609 Code:

    e3

  • Length:

    80 mm

  • Number of Functions:

    1

  • Number of Terminals:

    34

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    70 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    8.1 mm

  • Supply Voltage-Max (Vsup):

    800 V

  • Supply Voltage-Min (Vsup):

    300 V

  • Supply Voltage-Nom (Vsup):

    600 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    33 mm

NFVA23512NP2T Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan. Monitor junction temperature (TJ) and adjust the system design accordingly.
  • Monitor voltage, current, temperature, and power dissipation. Implement over-voltage, under-voltage, over-current, and over-temperature protection to prevent damage and ensure reliable operation.
  • Use a low-dropout linear regulator or a switching regulator with a high power conversion efficiency. Optimize the system design to minimize power losses, and consider using power-saving modes or dynamic voltage scaling.
  • Follow standard ESD handling procedures, including the use of ESD-protective packaging, wrist straps, and mats. Implement ESD protection circuits, such as TVS diodes or ESD arrays, in the system design.

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NFVA23512NP2T Overview

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