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NFVA33065L32 - onsemi

Description: 650 V/30 A 3−Phase IGBT Inverter with Integral Gate Drivers and Protections; Outstanding Thermal Resistance using AL2O3 DBC Substrate; Automotive SPM in 27 pin DIP package; Separated Open−Emitter Pins from Low−Side IGBTs for Three−Phase Current Sensing; Single−Grounded Power Supply; LVIC Temperature−Sensing Built−In for Temperature Monitoring; Isolation Rating: 2500 Vrms/1 min.; Pb−Free and RoHS compliant; 175°C guaranteed Short−Circuit Rated FS Trench IGBTs with stable EMI performance; WW 1st Automotive qu

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Symbol
NFVA33065L32 - onsemi - PCB symbol
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PCB Footprints
NFVA33065L32 - onsemi PCB footprint - Other - Other - 27LD MODULE PDD STD CASE MODCB ISSUE O_2
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3D Models
NFVA33065L32 - onsemi - 3D model - Other - 27LD MODULE PDD STD CASE MODCB ISSUE O_2
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NFVA33065L32 Details

  • Manufacturer Part Number:

    NFVA33065L32

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP-027

  • Manufacturer Package Code:

    MODCB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2018-11-19

  • Manufacturer:

    onsemi

  • YTEOL:

    8.8

  • Additional Feature:

    CONTROL SUPPLY VOLTAGE(VCC)= 15V

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDFM-T27

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    27

  • Output Current-Max:

    60 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    400 V

  • Supply Voltage-Nom (Vsup):

    300 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

NFVA33065L32 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 25V or higher. For input capacitors, 10uF to 22uF is recommended, while output capacitors should be 10uF to 47uF.
  • Use a shielded enclosure, keep sensitive components away from the NFVA33065L32, and ensure proper grounding and decoupling. Implement EMI filters or common-mode chokes if necessary.
  • Apply the input voltage first, followed by the enable signal. Ensure the input voltage is stable before applying the enable signal.

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NFVA33065L32 Overview

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