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NFVA34065L32 - onsemi

Description: 650 V/40 A 3−Phase IGBT Inverter with Integral Gate Drivers and Protections; WW 1st Automotive qualified grade HV module (AEC−Q100, 101 & AQG(LV)324); 175°C guaranteed Short−Circuit Rated FS Trench IGBTs with stable EMI performance; Outstanding Thermal Resistance using AL2O3 DBC Substrate; Automotive SPM in 27 pin DIP package; Separated Open−Emitter Pins from Low−Side IGBTs for Three−Phase Current Sensing; Single−Grounded Power Supply; LVIC Temperature−Sensing Built−In for Temperature Monitoring; Isolation

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PCB Footprints
NFVA34065L32 - onsemi PCB footprint - Other - Other - 27LD MODULE PDD STD CASE MODCB ISSUE A_2024_1
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3D Models
NFVA34065L32 - onsemi  - 3D model - Other - 27LD MODULE PDD STD CASE MODCB ISSUE A_2024_1
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NFVA34065L32 Details

  • Manufacturer Part Number:

    NFVA34065L32

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP-027

  • Package Description:

    DIP-27

  • Manufacturer Package Code:

    MODCB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-11-19

  • Manufacturer:

    onsemi

  • YTEOL:

    8.8

  • Additional Feature:

    CONTROL SUPPLY VOLTAGE(VCC)= 15V

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDFM-T27

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    27

  • Output Current-Max:

    80 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    400 V

  • Supply Voltage-Nom (Vsup):

    300 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

NFVA34065L32 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a thermal plane or a heat sink.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and use a thermal interface material (TIM) with a high thermal conductivity. Additionally, consider using a device with a higher temperature rating or implementing thermal monitoring and shutdown mechanisms.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection for the NFVA34065L32, it's recommended to follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits or devices in the system design. Additionally, consider using a device with built-in ESD protection or adding external ESD protection components.
  • The recommended soldering and assembly techniques for the NFVA34065L32 involve using a soldering iron with a temperature range of 250°C to 260°C, a soldering time of 3-5 seconds, and a peak temperature of 240°C. It's also essential to follow the recommended land pattern and soldering guidelines to ensure reliable connections.

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NFVA34065L32 Overview

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