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NIF62514T1G - onsemi

Description: Current Limitation; Thermal Shutdown with Automatic Restart; Short Circuit Protection; Overvoltage Clamped Protection; IDSS Specified at Elevated Temperature; Avalanche Energy Specified; Slew Rate Control for Low Noise Switching; ESD protected; Pb-Free Packages are Available

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NIF62514T1G - onsemi PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - NIF62514T1G+
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NIF62514T1G Details

  • Manufacturer Part Number:

    NIF62514T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-223 (TO-261) 4 LEAD

  • Package Description:

    TO-261, SOT-223, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    0.0318

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    300 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain-source On Resistance-Max:

    0.12 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-261AA

  • JESD-30 Code:

    R-PDSO-G4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    8.93 W

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    100 ns

  • Turn-on Time-Max (ton):

    28 ns

NIF62514T1G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NIF62514T1G should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is properly heatsinked, and the junction temperature (Tj) is kept below the maximum rating of 150°C. Also, consider derating the device's power handling at high temperatures.
  • The NIF62514T1G has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of HBM (Human Body Model) 2kV and MM (Machine Model) 200V ESD protection is recommended.
  • Yes, the NIF62514T1G is qualified for automotive and high-reliability applications. However, it's essential to follow the recommended qualification and testing procedures outlined in the AEC-Q101 standard.
  • To troubleshoot issues with the NIF62514T1G, start by verifying the power supply voltage, checking for proper heatsinking, and ensuring that the device is operated within its recommended operating conditions. Use oscilloscopes and logic analyzers to debug signal integrity issues.

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NIF62514T1G Overview

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