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NIS4461MT1TXG - onsemi

Description: Current Sense (ISENSE); Low Quiescent Current; Tri-state EN/FLT pin; Programmable current limit; Programmable slew rate

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NIS4461MT1TXG - onsemi - PCB symbol
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PCB Footprints
NIS4461MT1TXG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFN10, 3x3, 0.5P CASE 522AA−01 ISSUE A
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3D Models
NIS4461MT1TXG - onsemi - 3D model - Small Outline No-lead - WDFN10, 3x3, 0.5P CASE 522AA−01 ISSUE A
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NIS4461MT1TXG Details

  • Manufacturer Part Number:

    NIS4461MT1TXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-10

  • Package Description:

    WDFN-10

  • Manufacturer Package Code:

    522AA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    eFUSE

  • JESD-30 Code:

    S-PDSO-N10

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HWSON

  • Package Equivalence Code:

    SOLCC10,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    24 V

  • Supply Voltage-Min (Vsup):

    9 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    +6.5V

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NIS4461MT1TXG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal via array under the package is recommended. The thermal pad should be connected to a solid ground plane to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Avoid overheating the device, as it can lead to reduced reliability and lifespan.
  • The NIS4461MT1TXG has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in an ESD-controlled environment.
  • Yes, the NIS4461MT1TXG is suitable for high-reliability applications. It's manufactured using a robust process and has undergone rigorous testing to ensure its reliability. However, it's essential to follow proper design and assembly guidelines to ensure the device operates within its specifications.
  • Use a systematic approach to troubleshoot issues. Check the power supply, input signals, and output loads. Verify that the device is operated within its specifications. Use oscilloscopes or logic analyzers to debug the issue. Consult the datasheet and application notes for guidance.

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NIS4461MT1TXG Overview

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