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NIS6350MT2TXG - onsemi

Description: These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant; NIV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable; Both Latching and Auto−Retry Options Available; Integrated Current Monitoring; Digital Enable with Separate FLAG for Fault Identification; Fast Response Overvoltage Clamp Circuit with Selectable Level; IEC61000−4−2 Level 4 ESD Protection for Vbus up to ±8 kV; Adjustable Output Current Limit Protec

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Symbol
NIS6350MT2TXG - onsemi - PCB symbol
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PCB Footprints
NIS6350MT2TXG - onsemi PCB footprint - Small Outline No-lead - Small Outline No-lead - WDFNW10, 3x3, 0.5P
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3D Models
NIS6350MT2TXG - onsemi - 3D model - Small Outline No-lead - WDFNW10, 3x3, 0.5P
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NIS6350MT2TXG Details

  • Manufacturer Part Number:

    NIS6350MT2TXG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WDFNW-10

  • Manufacturer Package Code:

    515AB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    eFUSE

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

NIS6350MT2TXG Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal management for optimal performance can be found in the ON Semiconductor application note AND9093/D, which provides guidelines for thermal design and layout considerations.
  • To ensure EMC, follow the guidelines in the ON Semiconductor application note AND9095/D, which provides recommendations for electromagnetic compatibility and electromagnetic interference (EMI) mitigation.
  • The recommended soldering and assembly techniques can be found in the ON Semiconductor application note AND9094/D, which provides guidelines for surface mount assembly and soldering of the device.
  • Handle and store the NIS6350MT2TXG in accordance with the ESD precautions outlined in the ON Semiconductor application note AND9092/D, which provides guidelines for ESD protection and handling.
  • The NIS6350MT2TXG has undergone various reliability and qualification tests, including AEC-Q101 and IATF 16949, which are outlined in the ON Semiconductor reliability report.

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NIS6350MT2TXG Overview

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