Please enter a minimum 3 letters or numbers
Technical Content
Part Image

NIV1161MTTAG - onsemi

Description: Mixed Technology TVS Device 1 Circuit 34V Surface Mount 6-WDFN (2x2)

Download NIV1161MTTAG Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
NIV1161MTTAG - onsemi - PCB symbol
click to zoom
PCB Footprints
NIV1161MTTAG - onsemi PCB footprint - Other - Other - WDFN6 2x2, 0.65P
click to zoom
3D Models
NIV1161MTTAG - onsemi - 3D model - Other - WDFN6 2x2, 0.65P
click to zoom

NIV1161MTTAG Details

  • Manufacturer Part Number:

    NIV1161MTTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-6

  • Package Description:

    WDFN-6

  • Manufacturer Package Code:

    511CB

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • JESD-30 Code:

    S-PDSO-N6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Telecom IC Type:

    GAS DISCHARGE TUBE SUPPRESSOR

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NIV1161MTTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure reliable operation.
  • Consult the application note and reference design provided by onsemi. Optimize the PCB layout, component selection, and thermal management system for your specific use case.
  • Follow the recommended soldering temperature profile and assembly guidelines provided in the datasheet. Ensure proper handling and storage of the device to prevent damage.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

NIV1161MTTAG Overview

Use the download button to access the NIV1161MTTAG schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NIV11, or try a keyword search, such as Telecom Protection Circuits

Parts related to NIV1161MTTAG

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑