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NIV1241MTWTAG - onsemi

Description: 24V Low Capacitance ESD Protection with short−to−battery blocking for Automotive High Speed Data Lines

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NIV1241MTWTAG - onsemi PCB footprint - Other - Other - NIV1241MTWTAG-3
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NIV1241MTWTAG - onsemi  - 3D model - Other - NIV1241MTWTAG-3
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NIV1241MTWTAG Details

  • Manufacturer Part Number:

    NIV1241MTWTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFNW6 2.0x2.2, 0.65P

  • Package Description:

    WDFNW-6

  • Manufacturer Package Code:

    515AK

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2020-08-12

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    ULTRA LOW CAPACITANCE

  • Breakdown Voltage-Max:

    28 V

  • Breakdown Voltage-Min:

    24 V

  • Breakdown Voltage-Nom:

    25 V

  • Clamping Voltage-Max:

    43 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-N6

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    688 W

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    23.5 V

  • Reverse Current-Max:

    0.5 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

NIV1241MTWTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF values, and for output capacitors, use 10uF to 47uF values.
  • Use a shielded enclosure, keep the device and surrounding components away from the PCB edge, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
  • Apply the input voltage (VIN) first, followed by the enable signal (EN). Ensure the input voltage is stable before applying the enable signal.

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NIV1241MTWTAG Overview

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