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NIV2161MTTAG - onsemi

Description: Low Capacitance (0.65 pF Typical, I/O to GND); Diode Capacitance Matching Between I/O’s: 1% Typical; Optimized Layout; Protection for the Following IEC Standards: IEC 61000−4−2 (Level 4); Low ESD Clamping Voltage; Short-to-battery and short-to-GND Protection

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NIV2161MTTAG - onsemi - PCB symbol
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PCB Footprints
NIV2161MTTAG - onsemi PCB footprint - Other - Other - NIV2161MTTAG-1
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3D Models
NIV2161MTTAG - onsemi - 3D model - Other - NIV2161MTTAG-1
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NIV2161MTTAG Details

  • Manufacturer Part Number:

    NIV2161MTTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    WDFN-10

  • Manufacturer Package Code:

    511CA

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2017-07-28

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • JESD-30 Code:

    R-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Telecom IC Type:

    GAS DISCHARGE TUBE SUPPRESSOR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.675 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NIV2161MTTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device can help to dissipate heat efficiently. It's also recommended to keep the thermal path short and use a thermal pad on the PCB.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins. Follow the recommended PCB layout guidelines for ESD protection, and ensure that the device is handled and stored in an ESD-safe environment.
  • Check the input voltage and current levels to ensure they are within the recommended specifications. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use an oscilloscope to monitor the device's behavior and identify any anomalies.
  • Use a 4-wire Kelvin connection to measure the device's voltage and current accurately. Ensure that the test equipment is calibrated and that the measurement setup is properly configured. Follow the recommended test procedures outlined in the datasheet and application notes.

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NIV2161MTTAG Overview

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