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NJVMJD31CG - onsemi

Description: Lead Formed for Surface Mount Applications in Plastic Sleeves (No Suffix); Straight Lead Version in Plastic Sleeves ("1G"Suffix); Lead Formed Version in 16 mm Tape and Reel ("T4G" Suffix); Electrically Similar to Popular TIP31 and TIP32 Series; NJV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb−Free and are RoHS Compliant

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NJVMJD31CG Details

  • Manufacturer Part Number:

    NJVMJD31CG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3

  • Package Description:

    DPAK-3/2

  • Manufacturer Package Code:

    369C

  • Country Of Origin:

    Vietnam

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

NJVMJD31CG Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The device has internal ESD protection, but it's still recommended to follow standard ESD handling precautions during assembly and storage. Use an ESD wrist strap or mat, and store the devices in anti-static packaging.
  • Yes, but be aware of the device's switching characteristics and ensure that the switching frequency is within the recommended range. Also, consider the impact of parasitic inductance and capacitance on the device's performance.
  • Use a systematic approach to troubleshoot: check the power supply, verify the device is properly soldered, and inspect for signs of physical damage. Use a scope to analyze the device's behavior and consult the datasheet for guidance.

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NJVMJD31CG Overview

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Part Image KSH31CTF onsemi

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Part Image CJD31C Central Semiconductor Corp

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Part Image MJD31CTF onsemi

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Part Image CJD31CBK Central Semiconductor Corp

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For a full list of alternate parts for NJVMJD31CG, check out Findchips.com