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NL17SG17DFT2G - onsemi

Description: Wide Operating VCC Range: 0.9 V to 3.6 V; High Speed: tPD = 2.5 ns (Typ) at VCC = 3.0 V, CL = 15 pF; Low Power Dissipation: ICC = 0.5uA (Max) at TA = 25C; 4.6 V Overvoltage Tolerant (OVT) Input Pins; UltraSmall Packages; These are PbFree and HalideFree Devices

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Symbol
NL17SG17DFT2G - onsemi - PCB symbol
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PCB Footprints
NL17SG17DFT2G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - -SC−88A (SC−70−5/SOT−353)
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3D Models
NL17SG17DFT2G - onsemi - 3D model - SOT23 (5-Pin) - -SC−88A (SC−70−5/SOT−353)
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NL17SG17DFT2G Details

  • Manufacturer Part Number:

    NL17SG17DFT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-88A / SC-70-5

  • Pin Count:

    5

  • Manufacturer Package Code:

    419A-02

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    17SG

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.008 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    6.1 ns

  • Propagation Delay (tpd):

    58.1 ns

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NL17SG17DFT2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using a thermal interface material to reduce thermal resistance.
  • Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • To handle ESD protection during handling and assembly, it's recommended to follow standard ESD handling procedures, such as using an ESD wrist strap, ESD mat, or ESD bag. Additionally, ensure that the device is stored in its original packaging or an ESD-protective container when not in use.
  • The recommended soldering conditions for the NL17SG17DFT2G involve using a soldering iron with a temperature range of 250°C to 260°C, and a soldering time of 3-5 seconds. It's also recommended to use a solder with a melting point of 217°C to 221°C.

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NL17SG17DFT2G Overview

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