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NL17SV32XV5T2G - onsemi

Description: Extremely High Speed: tPD = 1.0 ns (Typ) at VCC; Designed for 1.0 to 3.3V Operation; Overvoltage Tolerance(OVT*) Input/Outputs Permits Logic Translation; Balanced ± 24 mA Output Drive @ 3.3 Volts; Near Zero Static Supply Current; Ultra-Tiny SOT-553 5 Pin Package, only 1.6 x 1.6 mm footprint, 1/3 the footprint area of a SOT-23; All Devices in Package SOT-553 are Inherently Pb-Free**

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NL17SV32XV5T2G - onsemi - PCB symbol
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NL17SV32XV5T2G - onsemi PCB footprint - Other - Other - NL17SV32XV5T2G-1
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NL17SV32XV5T2G - onsemi - 3D model - Other - NL17SV32XV5T2G-1
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NL17SV32XV5T2G Details

  • Manufacturer Part Number:

    NL17SV32XV5T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-553, 5 LEAD

  • Pin Count:

    5

  • Manufacturer Package Code:

    463B-01

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.95

  • Family:

    AUP/ULP/V

  • JESD-30 Code:

    R-PDSO-F5

  • Length:

    1.6 mm

  • Load Capacitance (CL):

    30 pF

  • Logic IC Type:

    OR GATE

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    USSOF

  • Package Equivalence Code:

    FL5/6,.047,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, ULTRA THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.005 mA

  • Prop. Delay@Nom-Sup:

    4 ns

  • Propagation Delay (tpd):

    18.6 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.2 mm

NL17SV32XV5T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the package.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal throttling or shutdown. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Operating the device at the maximum junction temperature (TJMAX) can reduce its lifespan and reliability. It's recommended to keep the junction temperature at least 10-20°C below TJMAX to ensure optimal performance and longevity.
  • The NL17SV32XV5T2G has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap, mat, or workstation, and ensure that all equipment is properly grounded.
  • The recommended soldering conditions for the NL17SV32XV5T2G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a temperature ramp rate of 3°C/second. It's also recommended to use a solder with a melting point of 217°C or higher.

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NL17SV32XV5T2G Overview

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