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NL17SZ32DFT2G-Q - onsemi

Description: Tiny SOT-353 and SOT-553 Packages; 2.4 ns TPD at 5 Volts (typ); Source/Sink 24 mA at 3.0 Volts; Over-Voltage Tolerant Inputs and Outputs; Pin For Pin with NC7SZ32P5X, TC7SZ32FU, and TC7SZ32AFE; Chip Complexity: FETs = <100; Designed for 1.65 V to 5.5 V VCC; Pb-Free Packages are Available; Designed for 1.65 V to 5.5 V Vcc Operation

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PCB Footprints
NL17SZ32DFT2G-Q - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - SC-88A
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3D Models
NL17SZ32DFT2G-Q - onsemi  - 3D model - SOT23 (5-Pin) - SC-88A
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NL17SZ32DFT2G-Q Details

  • Manufacturer Part Number:

    NL17SZ32DFT2G-Q

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88A / SC-70-5

  • Package Description:

    SC-88A, 5 PIN

  • Manufacturer Package Code:

    419A-02

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    OR GATE

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    2

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP5/6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    5.5 ns

  • Propagation Delay (tpd):

    12.7 ns

  • Schmitt Trigger:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NL17SZ32DFT2G-Q Frequently Asked Questions (FAQs)

  • A good PCB layout for the NL17SZ32DFT2G-Q should consider signal integrity, power integrity, and thermal management. Keep the signal traces short and away from noise sources, use a solid ground plane, and ensure good thermal conduction to the PCB. Refer to onsemi's application notes and layout guidelines for more information.
  • The NL17SZ32DFT2G-Q requires a specific power-up and power-down sequencing to ensure proper operation. Power up the VCC supply first, followed by the VCCIO supply. During power-down, reverse the sequence. Ensure that the power supplies are ramped up and down slowly to prevent damage to the device.
  • The NL17SZ32DFT2G-Q has a maximum junction temperature of 150°C. Ensure good thermal conduction to the PCB by using thermal vias, thermal pads, and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow around the device.
  • A reliable reset circuit for the NL17SZ32DFT2G-Q should ensure that the device is properly reset during power-up and power-down. Use a reset IC or a discrete reset circuit that can handle the power-up and power-down sequencing requirements of the device. Ensure that the reset signal is clean and glitch-free.
  • The NL17SZ32DFT2G-Q has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, handle the device by the body or anti-static wrist strap, and ensure that the PCB is designed with ESD protection in mind.

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NL17SZ32DFT2G-Q Overview

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