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NL27WZ00USG-F22190 - onsemi

Description: Extremely High Speed: tPD 2.4 ns (typical) at VCC = 5 V; Designed for 1.65 V to 5.5 V VCC Operation; Over Voltage Tolerant Inputs; LVTTL Compatible – Interface Capability With 5 V TTL Logic with VCC = 3 V; LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Replacement for NC7WZ00; Chip Complexity: FET = 112; Pb-Free Package is Available; Designed for 1.65 V to 5.5 V Vcc Operation Wide Operating Vcc Range

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NL27WZ00USG-F22190 - onsemi  - 3D model
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NL27WZ00USG-F22190 Details

  • Manufacturer Part Number:

    NL27WZ00USG-F22190

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    US8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Family:

    27WZ

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    NAND GATE

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Inputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Propagation Delay (tpd):

    11 ns

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NL27WZ00USG-F22190 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad on the bottom of the package. A detailed layout guide can be found in the onsemi application note AND9238/D.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal design, and consider derating the device's power dissipation. Additionally, onsemi provides a thermal modeling tool to help estimate the device's junction temperature.
  • The NL27WZ00USG-F22190 has built-in ESD protection diodes on all pins, which can withstand up to 2 kV HBM and 100 V MM. To prevent latch-up, it's recommended to follow proper PCB design and layout guidelines, use a bypass capacitor on the power supply, and ensure that the device is operated within the recommended voltage and current ranges.
  • Yes, the NL27WZ00USG-F22190 is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is used within the specified temperature range and power dissipation limits.
  • The recommended soldering process for the NL27WZ00USG-F22190 involves using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30 seconds. It's essential to follow the onsemi recommended soldering guidelines to ensure reliable assembly and minimize the risk of damage.

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NL27WZ00USG-F22190 Overview

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