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NL27WZ32USG - onsemi

Description: Extremely High Speed: tPD 2.5 ns (typical) at VCC = 5 V; Designed for 1.65 V to 5.5 V VCC Operation; Over Voltage Tolerant Inputs and Outputs; LVTTL Compatible - Interface Capability With 5 V TTL Logic with VCC = 3 V; LVCMOS Compatible; 24 mA Balanced Output Sink and Source Capability; Near Zero Static Supply Current Substantially Reduces System Power Requirements; Replacement for NC7WZ32; Chip Complexity: FET = 120

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Symbol
NL27WZ32USG - onsemi - PCB symbol
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PCB Footprints
NL27WZ32USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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3D Models
NL27WZ32USG - onsemi - 3D model - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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NL27WZ32USG Details

  • Manufacturer Part Number:

    NL27WZ32USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    US8

  • Package Description:

    US-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    2.3 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    OR GATE

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Inputs:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    10.5 ns

  • Propagation Delay (tpd):

    10.5 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NL27WZ32USG Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to the onsemi application note AND9173/D for more details.
  • Ensure that the device is operated within the recommended voltage and current limits. Use a suitable heat sink and thermal interface material to maintain a junction temperature below 150°C. Also, follow the recommended PCB layout and thermal design guidelines.
  • The NL27WZ32USG has built-in ESD protection diodes. However, it's still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended voltage and current limits, and avoid voltage spikes or transients on the power supply lines.
  • Yes, the NL27WZ32USG is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is PPAP capable. However, it's essential to consult with onsemi's sales team and review the device's PPAP documentation before using it in a high-reliability or automotive application.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads. Follow the ESD handling procedures and use anti-static packaging materials.

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NL27WZ32USG Overview

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