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NL7SZ97DFT2G-Q - onsemi

Description: High Speed: tPD = 3.3 ns (Typ) @ VCC = 5.0 V; Low Power Dissipation: ICC = 1 A (Maximum) at TA = 25C; Power Down Protection Provided on inputs; Balanced Propagation Delays; Overvoltage Tolerant (OVT) Input and Output Pins; Ultra-Small Package; This is a Pb-Free Device

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Symbol
NL7SZ97DFT2G-Q - onsemi - PCB symbol
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PCB Footprints
NL7SZ97DFT2G-Q - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-88-1
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3D Models
NL7SZ97DFT2G-Q - onsemi - 3D model - SOT23 (6-Pin) - SC-88-1
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NL7SZ97DFT2G-Q Details

  • Manufacturer Part Number:

    NL7SZ97DFT2G-Q

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88-6 / SC-70-6 / SOT-363-6

  • Manufacturer Package Code:

    419B-02

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    MAJORITY LOGIC GATE

  • Max I(ol):

    0.032 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Inputs:

    3

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Prop. Delay@Nom-Sup:

    6.3 ns

  • Propagation Delay (tpd):

    14.4 ns

  • Schmitt Trigger:

    YES

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NL7SZ97DFT2G-Q Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. It's also recommended to use a thermal pad on the bottom of the package.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal throttling or shutdown. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The NL7SZ97DFT2G-Q has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, ESD mat, and ESD-safe packaging materials.
  • The NL7SZ97DFT2G-Q is an automotive-grade device, but it's essential to ensure that the specific application meets the AEC-Q100 qualification requirements. Additionally, consult with onsemi's automotive support team to ensure that the device meets the specific requirements of your application.
  • The recommended soldering profile for the NL7SZ97DFT2G-Q involves a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. It's essential to follow the recommended soldering profile to prevent damage to the device.

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NL7SZ97DFT2G-Q Overview

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