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NLAS325USG - onsemi

Description: Dual SPST Analog Switch

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PCB Footprints
NLAS325USG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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3D Models
NLAS325USG - onsemi  - 3D model - Small Outline Packages - US8 US SUFFIIX CASE 493-02 ISSUE B
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NLAS325USG Details

  • Manufacturer Part Number:

    NLAS325USG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    US8

  • Package Description:

    US-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    493-01

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    53 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    2.3 mm

  • Moisture Sensitivity Level:

    1

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Off-state Isolation-Nom:

    93 dB

  • On-state Resistance-Max (Ron):

    55 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    16 ns

  • Switch-on Time-Max:

    30 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

NLAS325USG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a proper heat sink design, ensure good airflow, and consider using a thermal interface material (TIM) to reduce thermal resistance. Monitor the device's junction temperature (TJ) and adjust the system design accordingly.
  • Use a pi-filter (C-L-C) or a common-mode choke to reduce EMI. Add a 10-100 nF capacitor between the input and ground to filter high-frequency noise. Ensure proper PCB layout and grounding to minimize noise coupling.
  • Choose a capacitor with a voltage rating > 2x the input voltage, and a capacitance value between 1-10 μF. X5R or X7R ceramic capacitors are suitable for most applications. Consider the capacitor's ESR and ESL for high-frequency performance.
  • Monitor the output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP) to ensure safe operation.

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NLAS325USG Overview

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