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NLAS4053DR2G - onsemi

Description: Analog Multiplexer/Demultiplexer

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NLAS4053DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16 CASE751B-05
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NLAS4053DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-16 CASE751B-05
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NLAS4053DR2G Details

  • Manufacturer Part Number:

    NLAS4053DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC 16 LEAD

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -5.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -3 V

  • Normal Position:

    NO

  • Number of Channels:

    2

  • Number of Functions:

    3

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    93 dB

  • On-state Resistance Match-Nom:

    15 Ω

  • On-state Resistance-Max (Ron):

    37 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Signal Current-Max:

    0.05 A

  • Supply Current-Max (Isup):

    0.08 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    28 ns

  • Switch-on Time-Max:

    28 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NLAS4053DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NLAS4053DR2G involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the EN pin to a voltage source (e.g., VCC) through a pull-up resistor (e.g., 10 kΩ). The EN pin should be biased to a logic high (VCC) to enable the device. Additionally, ensure the input voltage (VIN) is within the recommended range (2.7 V to 5.5 V).
  • The maximum current the NLAS4053DR2G can handle depends on the input voltage and the output load. The device can handle up to 1 A of output current. To calculate the maximum current, use the formula: IOUT = (VIN - VOUT) / RDS(ON), where RDS(ON) is the on-state resistance of the internal switch.
  • To protect the NLAS4053DR2G from overvoltage and undervoltage conditions, use a voltage regulator or a voltage supervisor to regulate the input voltage (VIN) within the recommended range (2.7 V to 5.5 V). Additionally, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device.
  • To manage thermal performance, ensure good airflow around the device, and consider using a heat sink or a thermal pad to dissipate heat. The device has a thermal shutdown feature that turns off the internal switch when the junction temperature exceeds 150°C. Monitor the device temperature and adjust the thermal management strategy accordingly.

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NLAS4053DR2G Overview

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