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NLASB3157DFT2G - onsemi

Description: High Speed: tPD = 1.0 ns (Typ) at VCC = 5.0 V; Low Power Dissipation: ICC = 2.0 uA (Max) at TA = 25C; Standard CMOS Logic Levels; High Bandwidth, Improved Linearity; Switches Standard NTSC/PAL Video, Audio, SPDIF and HDTV; May be used for Clock Switching, Data Mux'ing, etc.; Low RDS(ON); Break Before Make Circuitry, Prevents Inadvertent Shorts; Can Switch Balanced Signal Pairs, e.g. LVDS > 200 Bits/Sec; Latchup Performance Exceeds 300 mA; Pin for Pin Drop in for NC7SB3157; Tiny SC88 Package Only 2.0 x 2.1 m

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PCB Footprints
NLASB3157DFT2G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-88(SOT-363) CASE 419B-02 ISSUE Y
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3D Models
NLASB3157DFT2G - onsemi  - 3D model - SOT23 (6-Pin) - SC-88(SOT-363) CASE 419B-02 ISSUE Y
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NLASB3157DFT2G Details

  • Manufacturer Part Number:

    NLASB3157DFT2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Package Description:

    TSSOP, TSSOP6,.08

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Off-state Isolation-Nom:

    57 dB

  • On-state Resistance Match-Nom:

    0.5 Ω

  • On-state Resistance-Max (Ron):

    50 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    2.3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    13 ns

  • Switch-on Time-Max:

    24 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.25 mm

NLASB3157DFT2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and power handling. Consult with onsemi's application engineers for guidance.
  • Yes, the NLASB3157DFT2G is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, additional testing and validation may be required for specific use cases.
  • Follow proper ESD handling procedures during assembly and storage. The device has built-in ESD protection, but it's still important to take precautions to prevent damage.

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NLASB3157DFT2G Overview

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