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NLSV4T3144MUTAG - onsemi

Description: VCCA and VCCB Operating Range: 0.9 V to 4.5 V; High-Speed w/ Balanced Propagation Delay; Inputs and Outputs have OVT Protection to 4.5 V; Non-preferential VCCA and VCCB Sequencing; Outputs at 3-State until Active VCCA and VCCB are reached; Power-Off Protection; Ultra-Small packaging: 1.7 mm x 2.0 mm UQFN-12

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NLSV4T3144MUTAG - onsemi PCB footprint - Other - Other - NLSV4T3144MUTAG-1
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NLSV4T3144MUTAG - onsemi  - 3D model - Other - NLSV4T3144MUTAG-1
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NLSV4T3144MUTAG Details

  • Manufacturer Part Number:

    NLSV4T3144MUTAG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    UQFN12 2.0x1.7, 0.4P

  • Package Description:

    UQFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    523AE

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    4T

  • JESD-30 Code:

    R-XQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC12,.07X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    6.1 ns

  • Propagation Delay (tpd):

    6.1 ns

  • Seated Height-Max:

    0.55 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.6 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.7 mm

NLSV4T3144MUTAG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Follow proper ESD handling procedures when handling the device, such as using an ESD wrist strap or mat, and storing the device in an ESD-protective package. Additionally, consider implementing ESD protection circuits in the system design to prevent damage from electrostatic discharge.
  • When paralleling multiple devices, ensure that each device has its own current sense resistor and that the devices are properly synchronized to prevent oscillations. Also, consider the impact of paralleling on the overall system thermal design and ensure that the heat sink is capable of dissipating the combined heat load.

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NLSV4T3144MUTAG Overview

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