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NLSV8T244DWR2G - onsemi

Description: Nonpreferential VCCA and VCCB Sequencing; VCCA and VCCB can be 0.9 V to 4.5 V; HighSpeed w/ Balanced Propagation Delay; Inputs and Outputs have OVT Protection to 4.5 V; Outputs at 3State until Active VCC is Reached; PowerOff Protection; Outputs Switch to 3State with VCCB at GND; UltraSmall Packaging: 4.0 mm x 2.0 mm UDFN20

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NLSV8T244DWR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 20 WB CASE 751D-05
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NLSV8T244DWR2G - onsemi  - 3D model - Small Outline Packages - SOIC 20 WB CASE 751D-05
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NLSV8T244DWR2G Details

  • Manufacturer Part Number:

    NLSV8T244DWR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-20 WB

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    751D-05

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    8T

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    12.8 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    REGISTERED BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    3

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    3.3 ns

  • Propagation Delay (tpd):

    3.3 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    0.9 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

NLSV8T244DWR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to maintain reliability.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
  • Use a soldering temperature of 260°C (500°F) for a maximum of 10 seconds. Ensure that the soldering iron is set to a low temperature and the device is not exposed to excessive heat or moisture.

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NLSV8T244DWR2G Overview

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