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NLSX0102FC2T2G - onsemi

Description: VL can be Less than, Greater than or Equal to VCC; Wide VCC Operating Range: 1.5 V to 5.5 V; Wide VL Operating Range: 1.5 V to 5.5 V; High Speed with 24 Mb/s Guaranteed Date Rate; Low Bit to Bit Skew; Enable Input and I/O Pins are Overvoltage Tolerant (OVT) to 5.5 V; Non preferential Power up Sequencing; Integrated 10 k ohm Pull up Resistors; Small Space Saving Package:1.9 mm x 0.9 mm x 0.5 mm Flipchip8; This is a Pb Free Device; Low Voltage ASIC Level Translation; ESD Protection for All Pins: Human Body Mo

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NLSX0102FC2T2G - onsemi PCB footprint - BGA - BGA - 8 PIN FLIP−CHIP, 0.9x1.9, 0.5P CAS
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NLSX0102FC2T2G - onsemi  - 3D model - BGA - 8 PIN FLIP−CHIP, 0.9x1.9, 0.5P CAS
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NLSX0102FC2T2G Details

  • Manufacturer Part Number:

    NLSX0102FC2T2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    Flip-Chip-8

  • Package Description:

    FLIPCHIP-8

  • Manufacturer Package Code:

    499BF

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2018-07-23

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    NLSX

  • JESD-30 Code:

    R-PBGA-B8

  • JESD-609 Code:

    e1

  • Length:

    1.9 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XFBGA

  • Package Equivalence Code:

    BGA8,2X4,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, EXTREMELY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.002 mA

  • Prop. Delay@Nom-Sup:

    255 ns

  • Propagation Delay (tpd):

    255 ns

  • Seated Height-Max:

    0.5 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.5 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    0.9 mm

NLSX0102FC2T2G Frequently Asked Questions (FAQs)

  • A good PCB layout for NLSX0102FC2T2G involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. Refer to onsemi's application note AND8327/D for more details.
  • To ensure the NLSX0102FC2T2G operates within its recommended operating conditions, make sure to follow the recommended voltage and current ratings, and keep the junction temperature within the specified range. Also, ensure proper thermal management and avoid overheating.
  • The NLSX0102FC2T2G is capable of supporting data rates up to 1.5 Gbps. However, the actual data rate achieved may depend on the specific application, PCB layout, and signal integrity.
  • To troubleshoot issues with NLSX0102FC2T2G, use oscilloscopes or logic analyzers to monitor the signal quality and integrity. Check for signal reflections, ringing, or distortion, and ensure proper termination and impedance matching. Also, verify that the device is properly powered and configured.
  • The NLSX0102FC2T2G is a LVDS (Low-Voltage Differential Signaling) device, which is compatible with other LVDS devices. However, it may not be directly compatible with TTL or CMOS logic families, and may require level translation or buffering to ensure proper operation.

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