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NLSX3012DR2G - onsemi

Description: Wide Operating Range; Low Bit to Bit Skew; Overvoltage Tolerant Enable and I/O pins.

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NLSX3012DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC_NB-08
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NLSX3012DR2G - onsemi  - 3D model - Small Outline Packages - SOIC_NB-08
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NLSX3012DR2G Details

  • Manufacturer Part Number:

    NLSX3012DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOIC-8 Narrow Body

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Control Type:

    ENABLE HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    3012

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Load Capacitance (CL):

    15 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Prop. Delay@Nom-Sup:

    12 ns

  • Propagation Delay (tpd):

    12 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    4.5 V

  • Supply Voltage-Min (Vsup):

    1.3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NLSX3012DR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the NLSX3012DR2G should consider the following: keep the input and output traces short and symmetrical, use a solid ground plane, and place decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, follow these guidelines: VCC should be between 2.7V and 5.5V, VEE should be connected to a quiet analog ground, and the input voltage should be within the recommended range. Additionally, ensure that the input impedance is matched to the device's input impedance.
  • The NLSX3012DR2G is rated for operation from -40°C to +125°C. However, it's essential to consider the derating curves and thermal management to ensure reliable operation within the specified temperature range.
  • The NLSX3012DR2G has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap, mat, or workstation, and ensure that the device is handled in a static-safe environment.
  • The recommended soldering profile for the NLSX3012DR2G is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the device.

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NLSX3012DR2G Overview

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