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NLV14044BDR2G - onsemi

Description: Outputs Capable of Driving Two Low-power TTL Loads or One Low-Power Schottky TTL Load Over the Rated Temperature Range; Double Diode Input Protection; Three-State Outputs with Common Enable; Supply Voltage Range = 3.0 Vdc to 18 Vdc; Pb-Free Packages are Available*

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NLV14044BDR2G Details

  • Manufacturer Part Number:

    NLV14044BDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 16 LEAD

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    R-S LATCH

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    350 ns

  • Propagation Delay (tpd):

    350 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    HIGH LEVEL

  • Width:

    3.9 mm

NLV14044BDR2G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • Exceeding the maximum Tj rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to protect against electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s, and time above 183°C 150s. For rework, use a low-temperature soldering iron (< 350°C) and avoid applying excessive heat or force to the device.

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NLV14044BDR2G Overview

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