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NLV14081BDR2G - onsemi

Description: Capable of Driving Two Low-power TTL Loads or One Low-power Schottky TTL Load Over the Rated Temperature Range.; Pin-for-Pin Replacements for Corresponding CD4000 Series B Suffix Devices; All Outputs Buffered; Supply Voltage Range = 3.0 Vdc to 18 Vdc; Double Diode Protection on All Inputs Except: Triple Diode Protection on MC14011B and MC14081B; Pb-Free Packages are Available*

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NLV14081BDR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−14 NB CASE 751A−03 ISSUE L
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NLV14081BDR2G - onsemi  - 3D model - Small Outline Packages - SOIC−14 NB CASE 751A−03 ISSUE L
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NLV14081BDR2G Details

  • Manufacturer Part Number:

    NLV14081BDR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-14 NB

  • Package Description:

    SOIC-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    751A-03

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Family:

    4000/14000/40000

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    AND GATE

  • Max I(ol):

    0.004200000000000001 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    300 ns

  • Propagation Delay (tpd):

    300 ns

  • Qualification Status:

    Not Qualified

  • Schmitt Trigger:

    NO

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

NLV14081BDR2G Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path short and direct to the heat sink or thermal pad.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating temperature range, use a heat sink or thermal pad, and consider using thermal interface materials to improve heat transfer.
  • The recommended soldering conditions for the NLV14081BDR2G are: peak temperature 260°C, soldering time 10 seconds, and a soldering iron temperature of 350°C.
  • Yes, the NLV14081BDR2G is AEC-Q100 qualified, making it suitable for automotive applications. However, ensure that the device meets the specific requirements of your application, including temperature, voltage, and reliability.
  • To handle ESD protection for the NLV14081BDR2G, follow proper handling and storage procedures, use ESD-protective packaging, and consider adding external ESD protection devices or circuits in your design.

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