Description:4.6 V Overvoltage Tolerant (OVT) Input Pins; Wide Operating VCC Range: 0.9 V to 3.6 V; High Speed: tPD = 2.5 ns (Typ) at VCC = 3.0 V, CL = 15 pF; Low Power Dissipation: ICC = 0.5 uA (Max) at TA = 25C; UltraSmall Packages; These are PbFree and HalideFree Devices
HALOGEN FREE AND ROHS COMPLIANT, SC-88A, SC-70, SOT-353, 5 PIN
Manufacturer Package Code:
419A-02
Country Of Origin:
Mainland China
HTS Code:
8542.39.00.60
Factory Lead Time:
4 Weeks
Manufacturer:
onsemi
YTEOL:
0
Family:
17SG
JESD-30 Code:
R-PDSO-G5
JESD-609 Code:
e3
Length:
2 mm
Load Capacitance (CL):
30 pF
Logic IC Type:
INVERTER
Max I(ol):
0.0003 A
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Inputs:
1
Number of Terminals:
5
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSSOP
Package Equivalence Code:
TSSOP5/6,.08
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
260
Prop. Delay@Nom-Sup:
58.1 ns
Propagation Delay (tpd):
58.1 ns
Qualification Status:
Not Qualified
Schmitt Trigger:
YES
Screening Level:
AEC-Q100
Seated Height-Max:
1.1 mm
Supply Voltage-Max (Vsup):
3.6 V
Supply Voltage-Min (Vsup):
0.9 V
Supply Voltage-Nom (Vsup):
3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
MILITARY
Terminal Finish:
MATTE TIN
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
1.25 mm
NLV17SG14DFT2G Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance would involve placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink. Additionally, consider using a thermal interface material to reduce thermal resistance.
The recommended soldering conditions for the NLV17SG14DFT2G are: peak temperature of 260°C, soldering time of 10-30 seconds, and a soldering iron temperature of 350-370°C. It's also recommended to use a solder with a melting point above 217°C.
To handle ESD protection during handling and assembly, it's recommended to use an ESD wrist strap, ESD mat, or ESD chair. Ensure that all equipment and tools are properly grounded, and handle the devices by the body or leads, rather than the pins.
The recommended storage conditions for the NLV17SG14DFT2G are: temperature range of -40°C to 125°C, humidity of 60% or less, and protection from direct sunlight. It's also recommended to store the devices in their original packaging or in a sealed bag with desiccant.
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NLV17SG14DFT2G Overview
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