Description:24 mA Balanced Output Sink and Source Capability; Extremely High Speed: tPD 2.6 ns (typical) at VCC = 5 V; Over Voltage Tolerant Inputs and Outputs; LVTTL Compatible - Interface Capability With 5 V TTL Logic with VCC = 3 V; Designed for 1.65 V to 5.5 V VCC Operation; LVCMOS Compatible; Near Zero Static Supply Current Substantially Reduces System Power Requirements; 3-State OE Input is Active-Low; Replacement for NC7SZ125; Chip Complexity = 36 FETS
HALOGEN FREE AND ROHS COMPLIANT, SC-70, SC-88A, SOT-353, 5 PIN
Pin Count:
5
Manufacturer Package Code:
419A-02
Country Of Origin:
Mainland China
HTS Code:
8542.39.00.60
Factory Lead Time:
4 Weeks
Manufacturer:
onsemi
YTEOL:
0
Control Type:
ENABLE LOW
Count Direction:
UNIDIRECTIONAL
Family:
LVC/LCX/Z
JESD-30 Code:
R-PDSO-G5
JESD-609 Code:
e3
Length:
2 mm
Load Capacitance (CL):
50 pF
Logic IC Type:
BUS DRIVER
Max I(ol):
0.024 A
Moisture Sensitivity Level:
1
Number of Bits:
1
Number of Functions:
1
Number of Ports:
2
Number of Terminals:
5
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-55 °C
Output Characteristics:
3-STATE
Output Polarity:
TRUE
Package Body Material:
PLASTIC/EPOXY
Package Code:
TSSOP
Package Equivalence Code:
TSSOP5/6,.08
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method:
TR
Peak Reflow Temperature (Cel):
NOT SPECIFIED
Power Supply Current-Max (ICC):
0.01 mA
Prop. Delay@Nom-Sup:
6 ns
Propagation Delay (tpd):
10.5 ns
Qualification Status:
Not Qualified
Screening Level:
AEC-Q100
Seated Height-Max:
1.1 mm
Supply Voltage-Max (Vsup):
5.5 V
Supply Voltage-Min (Vsup):
1.65 V
Supply Voltage-Nom (Vsup):
1.8 V
Surface Mount:
YES
Technology:
TTL
Temperature Grade:
MILITARY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
NOT SPECIFIED
Width:
1.25 mm
NLV17SZ125DFT2G Frequently Asked Questions (FAQs)
A good PCB layout for NLV17SZ125DFT2G involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
To ensure the NLV17SZ125DFT2G operates within its SOA, monitor the device's junction temperature, input voltage, and output current. Use thermal management techniques such as heat sinks or thermal interfaces to keep the junction temperature below 150°C. Also, ensure the input voltage does not exceed 12V and the output current does not exceed 1.25A.
Exceeding the maximum ratings of NLV17SZ125DFT2G can lead to device failure, reduced lifespan, or even catastrophic failure. This can result in damage to the device, surrounding components, or even the entire system. It is essential to operate the device within its recommended operating conditions to ensure reliability and performance.
To troubleshoot issues with NLV17SZ125DFT2G, start by verifying the device's pin connections and voltage levels. Check for any signs of physical damage, overheating, or electrical overstress. Use oscilloscopes or logic analyzers to monitor the device's input and output signals. Consult the datasheet and application notes for guidance on troubleshooting common issues.
Yes, NLV17SZ125DFT2G is suitable for high-reliability and safety-critical applications. However, it is essential to follow proper design and manufacturing guidelines, including using qualified components, adhering to recommended operating conditions, and implementing robust testing and validation procedures.
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NLV17SZ125DFT2G Overview
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