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NLV25T-1R2J-EF - TDK

Description: TDK - NLV25T-1R2J-EF - High Frequency Inductor, 1.2 ?H, NLV Series, 230 mA, 1008 [2520 Metric], Wirewound, 1.2 ohm

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PCB Footprints
NLV25T-1R2J-EF - TDK PCB footprint - Inductor Moulded - Inductor Moulded - NLV25T_2021
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3D Models
NLV25T-1R2J-EF - TDK  - 3D model - Inductor Moulded - NLV25T_2021
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NLV25T-1R2J-EF Details

  • Manufacturer Part Number:

    NLV25T-1R2J-EF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    6

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    1.2 Ω

  • Inductance-Nom (L):

    1.2 µH

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.8 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Blister Plastic, 7 Inch

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.23 A

  • Self Resonance Frequency:

    230 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN COPPER

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    5%

NLV25T-1R2J-EF Frequently Asked Questions (FAQs)

  • The recommended land pattern for NLV25T-1R2J-EF is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While NLV25T-1R2J-EF has a rated operating temperature range of -55°C to +125°C, it's essential to consider the derating curve and ensure that the component doesn't exceed its maximum rated temperature during operation. Consult TDK's application notes for guidance on high-temperature applications.
  • NLV25T-1R2J-EF is a moisture-sensitive device. To prevent damage, store the components in a dry environment (less than 20% RH) and follow TDK's recommended handling and storage procedures. Use a dry pack or desiccant to maintain a low humidity environment during storage.
  • TDK recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
  • While NLV25T-1R2J-EF is designed to withstand some level of vibration and shock, it's crucial to evaluate the component's performance in your specific application. Consult TDK's reliability data and perform thorough testing to ensure the component meets your requirements.

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NLV25T-1R2J-EF Overview

Use the download button to access the NLV25T-1R2J-EF schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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