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NLV25T-R56J-PF - TDK

Description: Inductor RF Chip Unshielded Wirewound 560nH 5% 25.2MHz 30Q-Factor Ferrite 325mA 750mOhm DCR 1008 T/R

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NLV25T-R56J-PF - TDK - PCB symbol
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PCB Footprints
NLV25T-R56J-PF - TDK PCB footprint - Inductor Moulded - Inductor Moulded - NLV25-PF
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3D Models
NLV25T-R56J-PF - TDK - 3D model - Inductor Moulded - NLV25-PF
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NLV25T-R56J-PF Details

  • Manufacturer Part Number:

    NLV25T-R56J-PF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    1008

  • Construction:

    Magnetic Shielded

  • Core Material:

    FERRITE

  • DC Resistance:

    0.75 Ω

  • Inductance-Nom (L):

    0.56 µH

  • Inductor Application:

    RF INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.8 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, 7 Inch

  • Quality Factor-Min (at L-nom):

    30

  • Rated Current-Max:

    0.325 A

  • Self Resonance Frequency:

    325 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    25.2 MHz

  • Tolerance:

    5%

NLV25T-R56J-PF Frequently Asked Questions (FAQs)

  • The recommended land pattern for NLV25T-R56J-PF is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm.
  • To handle thermal considerations, ensure a good thermal connection to a heat sink or a large copper area on the PCB. The thermal resistance of the component is 25°C/W, and the maximum operating temperature is 125°C.
  • The recommended reflow soldering profile for NLV25T-R56J-PF is a peak temperature of 260°C, with a dwell time above 220°C of 20-40 seconds, and a total process time of 3-5 minutes.
  • Yes, NLV25T-R56J-PF is designed to withstand high-vibration environments. It has a vibration resistance of 10G (10-2000Hz) and a shock resistance of 100G (11ms).
  • To ensure reliability in a humid environment, apply a conformal coating to the component, and ensure the PCB is designed with a moisture-resistant finish. The component itself has a moisture sensitivity level (MSL) of 3.

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This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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NLV25T-R56J-PF Overview

Use the download button to access the NLV25T-R56J-PF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like NLV25, or try a keyword search, such as Fixed Inductors

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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