The recommended land pattern for NLV25T-R68J-EF is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm.
To handle thermal considerations, ensure a good thermal connection to a heat sink or a large copper area on the PCB. The thermal resistance of the component is 10°C/W, and the maximum operating temperature is 125°C.
The recommended soldering profile for NLV25T-R68J-EF is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
Yes, NLV25T-R68J-EF is designed to withstand high-vibration applications. It has a vibration resistance of 10G, and is suitable for use in automotive and industrial applications.
To ensure reliability in humid environments, apply a conformal coating to the component, and ensure that the PCB is designed with moisture-resistant materials. The component itself has a moisture sensitivity level of 3, and can withstand humid environments up to 85°C and 85% RH.
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NLV25T-R68J-EF Overview
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About TDK
TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.
